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Telecommunication

Product Detail Information

Specifications
Layers 4~10L
Base Material High-Tg,FR-4,Halogen Free,RoHS,RCC,Aramid
Board Thickness 15.75~47.24mil : 0.4~1.2mm
Min. Line Width 2.5mil : 64㎛
Min. Line Spacing 2.5mil : 64㎛
Min. Mech. Drill Size 5.91mil : 150㎛
Min. Laser Drill Size 3.94mil : 100㎛
Surface Treatment Immersion Gold, OSP, Selective OSP
Application Cellular Phone, PCS, Hand Held Device, PDA