Product Category menu

Category background

Package Substrate

Product Detail Information

Specifications
Layers 2~8L
 
Base Material High-Tg,FR-4,RCC,BT-Resin
 
Board Thickness 3.94~31.50mil : 0.1~0.8mm
 
Min. Line Width 1.2mil : 30㎛
 
Min. Line Spacing 1.4mil : 35㎛
 
Min. Mech. Drill Size 3.94mil : 100㎛
 
Min. Laser Drill Size 2.36mil : 60㎛
 
Min. Ball/Bump Pad Pitch 8.86mil : 225㎛
 
Surface Treatment Wire Boardable Gold, Immersion Gold, OSP
 
Application PCMCIA Card, Telecommunication, LapTop, PCS, Chipsets